DRACO Advances Service Through Three Core Quality Policies

DRACO Materials Technology specializes in the R&D and manufacturing of inorganic composite materials—including alloys, ceramics, and precision components—supporting critical semiconductor consumables across crystal growth, wafer slicing and grinding, front-end CMP, wafer thinning, and advanced packaging dicing. Our solutions comprehensively serve 8-inch to 12-inch wafer processes.

As global semiconductor capacity expands and demand for grinding, polishing, and dicing consumables continues to rise, DRACO leverages patented formulations, proprietary process technologies, and high material compatibility to co-develop with leading customers—shifting from import dependence toward localized manufacturing and strengthening supply chain resilience.

Backed by entrepreneurial drive, industry-academia expertise, and multinational management experience, our team embraces a mentorship-based talent model to drive cost efficiency, process innovation, and sustainable localization.