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Draco Materials
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    • About Draco

      DRACO Materials Technology is rooted in three core semiconductor processes—dicing, grinding, and polishing—delivering high-quality, highly customized solutions.

      Teams

      Backed by solid R&D and industry expertise, the DRACO team is committed to professionalism, accountability, and long-term trust.

      ESG Mission

      Committed to sustainable processes, employee safety, and advancing future technologies.

      ISO 9001 Certified

      Standardized quality management ensuring consistent performance and reliable delivery.

      Join DRACO

      Grow with us and shape the future together.

  • Products & ServicesExpand
    • Grinding Wheels

      Ensuring wafer flatness and surface quality.

      Diamond Discs

      High-precision, stable grinding.

      鑽石碟

      Dicing Blades

      Precise, long-life cutting solutions.

      Semiconductor Consumables & Equipment Distribution

      Integrated supply of semiconductor materials and equipment.

      Contract Manufacturing Services

      Professional wafer processing solutions.

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Draco Materials

Wafer Consumables Solutions

DRACO
Your Total Wafer Consumables Expert Across the Entire Process Chain

From in-house R&D to precision manufacturing, we deliver high-efficiency, high-stability solutions in grinding wheels, diamond discs, and dicing blades.

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About DRACO

DRACO Materials Technology specializes in critical semiconductor processes—including dicing, grinding, and polishing—delivering high-quality, highly customized material solutions.

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Semiconductor Consumables

Professional Semiconductor Consumables

DRACO is firmly rooted in the three core semiconductor processes—dicing, grinding, and polishing—providing high-quality, highly customized solutions.

Grinding Wheels

Specifically engineered to address the machining challenges of third-generation semiconductors (SiC) and the ultra-thin grinding requirements of conventional Si wafers. Leveraging an innovative porous ceramic/resin hybrid bond technology, our grinding wheels achieve the optimal balance between abrasive retention strength and self-dressing performance.

Diamond Discs

Featuring proprietary diamond patterning technology and corrosion-resistant substrates, our diamond discs precisely condition polishing pad surfaces—ensuring stable removal rates (RR) and flawless wafer surface quality for every run.

Dicing Blades

Formulated with proprietary bond systems and ultra-hard abrasives, our dicing blades strike the perfect balance between sharpness and durability—enabling maximum chips per wafer (CPW) and superior die yield.

Latest News

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Partnering with Industry to Build an Efficient and Sustainable Semiconductor Future

13.01.2026

DRACO Strengthens Quality Management to Enhance Yield and Process Consistency

13.01.2026

DRACO Develops Environmentally Responsible Material Solutions

13.01.2026

DRACO Advances Semiconductor Process Upgrades Through Continuous Materials Innovation

13.01.2026

DRACO Delivers Stable and Reliable Process Materials

13.01.2026

DRACO Advances Highly Customized Material Solutions for Next-Generation Semiconductor Processes

13.01.2026

ESG Corporate Mission

DRACO Materials Technology advances sustainable semiconductor materials through innovation and precision manufacturing.

We uphold environmental responsibility, employee well-being, and transparent governance—driving high-efficiency, low-impact technologies for a sustainable future.

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Empowering Every Critical Step of the Process

DRACO Materials Technology advances sustainable semiconductor materials through continuous innovation and advanced R&D, enhancing process efficiency and quality stability.

We operate with environmental responsibility, prioritize employee safety, and uphold transparent governance—driving high-efficiency, low-impact solutions for a sustainable future.

DRACO Materials Technology specializes in critical semiconductor processes—including dicing, grinding, and polishing—delivering high-quality, highly customized material solutions.

Products & Services

  • Grinding Wheel
  • CMP Diamond Disk
  • Dicing Blade
  • Semiconductor Consumables
  • Contract Manufacturing

Support

  • Draco Research
  • Support

Contact

  • News Room
  • Join Draco
  • Contact Us

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  • Home
  • About DRACO
    • Teams
    • Quality Policy
    • Join Draco
  • Products and Services
    • Grinding Wheel
    • CMP Diamond Disk
    • Dicing Blade
    • Semiconductor Consumables
    • Contract Manufacturing
  • Corporate Sustainability
  • Draco Research
  • News Room
  • Contact Us