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FAQ

Get the information you need quickly or connect directly with our team.

We focus on three core semiconductor processes—dicing, grinding, and polishing—providing related consumables, tools, and integrated solutions.

Yes. We provide highly customized designs based on wafer material, size, equipment, and process conditions.

Our solutions are compatible with silicon, SiC, GaN, and other advanced semiconductor materials.

Wafer fabrication plants, OSAT providers, material R&D institutions, and equipment integrators.

Request Expert Process Consultation and Optimize Your Production

Whether you require product consultation, technical collaboration, customized solutions, or project evaluation, we welcome you to contact us. Our professional team will provide tailored recommendations based on your specific process conditions.

Please leave your inquiry through the contact form, and we will respond promptly.

Email

services@dracomaterials.com

Address

9F-5, No. 168, Sec. 2, Fuxing 3rd Rd.,
Zhubei City, Hsinchu County 302, Taiwan

Tel

+886-03-5527295