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Draco Materials
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  • AboutExpand
    • About Draco

      DRACO Materials Technology is rooted in three core semiconductor processes—dicing, grinding, and polishing—delivering high-quality, highly customized solutions.

      Teams

      Backed by solid R&D and industry expertise, the DRACO team is committed to professionalism, accountability, and long-term trust.

      ESG Mission

      Committed to sustainable processes, employee safety, and advancing future technologies.

      ISO 9001 Certified

      Standardized quality management ensuring consistent performance and reliable delivery.

      Join DRACO

      Grow with us and shape the future together.

  • Products & ServicesExpand
    • Grinding Wheels

      Ensuring wafer flatness and surface quality.

      Diamond Discs

      High-precision, stable grinding.

      鑽石碟

      Dicing Blades

      Precise, long-life cutting solutions.

      Semiconductor Consumables & Equipment Distribution

      Integrated supply of semiconductor materials and equipment.

      Contract Manufacturing Services

      Professional wafer processing solutions.

  • Sustainability
  • Research
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Draco Materials

About DRACO

DRACO Materials Technology is firmly rooted in the three core semiconductor processes—dicing, grinding, and polishing—delivering high-quality, highly customized solutions.

DRACO Materials

Corporate Mission

  • Collaborating closely with leading global equipment manufacturers and research institutions.
  • Strict quality control with full traceability from raw materials to finished products.
  • Advancing green manufacturing practices to achieve process-level carbon reduction goals.

Technical Expertise

  • Ceramic substrate and nano-diamond particle integration technology
  • High-wear-resistant metal alloy heat treatment processes
  • Surface coating and composite material microstructure engineering

Core Advantages

  • ISO 9001 Certified Quality Management System
  • 24/7 Customized Technical Support
  • Global Logistics Network with Localized Warehousing
Teams
Join Draco

Milestones

2021.01

Initial R&D Investment

2023.09

Establishment of DRACO Materials Co., Ltd.

2024.04

Successful Development of First-Generation Grinding Wheel

2024.11

Successful Development of First-Generation Diamond Disc (CDDP)

2025.02

Successful Development of Second-Generation Diamond Disc (CDDC)

2025.05

Establishment of Wuxi Tianlong New Materials Technology Co., Ltd.

2025.10

Wuxi Tianlong New Materials Technology Co., Ltd. Certified to GB/T 19001-2016 / ISO 9001:2015

2025.12

Listed on the Taiwan Emerging Stock Board (Ticker: 7698)

2026.01

Completion and Commissioning of DRACO’s New Manufacturing Facility

2026.02

Draco’s New Facility Successfully Achieves ISO 9001:2015 Certification

Locations

Headquarters

Draco Materials Co., Ltd.

  • No. 68, Xingong 3rd Rd., Zhubei City, Hsinchu County (Manufacturing Facility)
  • No. 66, Zhonghe St., Zhubei City, Hsinchu County (New Facility)
  • 9F-5, No. 168, Sec. 2, Fuxing 3rd Rd., Zhubei City, Hsinchu County (HSR Office)
  • +886 3 5527295

Wuxi Branch, China

Draco Advanced Materials (Wuxi) Co., Ltd.

  • No. 8, Jinbo Building, Hongyi Rd., Xin’an Subdistrict, Xinwu District, Wuxi, Jiangsu Province, China
  • +86-510-85382239

DRACO Materials Technology specializes in critical semiconductor processes—including dicing, grinding, and polishing—delivering high-quality, highly customized material solutions.

Products & Services

  • Grinding Wheel
  • CMP Diamond Disk
  • Dicing Blade
  • Semiconductor Consumables
  • Contract Manufacturing

Support

  • Draco Research
  • Support

Contact

  • News Room
  • Join Draco
  • Contact Us

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  • Home
  • About DRACO
    • Teams
    • Quality Policy
    • Join Draco
  • Products and Services
    • Grinding Wheel
    • CMP Diamond Disk
    • Dicing Blade
    • Semiconductor Consumables
    • Contract Manufacturing
  • Corporate Sustainability
  • Draco Research
  • News Room
  • Contact Us