Dicing Blade

High precision, low chipping performance, and extended tool life, supporting a wide range of packaging technologies and material substrates.

Product Features
  • High precision, low chipping, improved yield
  • High hardness and heat resistance for longer life
  • Excellent self-sharpening, reduced downtime
  • Compatible with QFN / BGA / WLCSP
Process Applications
  • Precision dicing of silicon, ceramic, and glass
  • Package singulation for power and sensor devices
Recommended Specifications
  • Grit: #2000–#12000 (customizable)
  • Bond: Metal / Resin
  • Dimensions: Custom per application