Contract Manufacturing Services

Draco Materials provides heterogeneous bonding and full wafer processing services for 4, 6, 8, and 12-inch wafers, supporting SOI, POI, SiC, TFLN/TFLT, SiCOI, diamond bonding, and other customized substrates.

Our process-driven approach covers material selection, parameter optimization, and quality control—improving yield, efficiency, and production stability.

6-inch glass substrates
(thinning solutions)

SiC dressing plates

Service Strengths

  • 高度客製化製程能力Highly customized process capability
  • 高度客製化製程能力Strict quality control
  • 高度客製化製程能力Close collaboration with equipment manufacturers and research institutions
  • 高度客製化製程能力Support from pilot runs to mass production

Applications

  • 高度客製化製程能力Wafer dicing and grinding materials
  • 高度客製化製程能力High-precision polishing and surface processing
  • 高度客製化製程能力Advanced and complex material applications
  • 高度客製化製程能力Customized consumables and process-support components

A Process-Oriented Manufacturing Partner

Beyond contract manufacturing, Draco Materials serves as a long-term partner in process development—supporting customers in achieving higher yield, improved efficiency, and a stable, sustainable supply chain.