Grinding Wheel

Engineered to benchmark international standards, featuring excellent self-sharpening performance and extended service life to meet diverse Si and SiC process requirements.

Product Features
  • Manufacturing quality benchmarked against leading global brands
  • Proprietary material formulations and exclusive process technology
  • Excellent self-sharpening performance for extended service life
  • Custom design options to meet diverse process requirements
Process Applications
  • SiC wafer grinding and thinning (6” / 8” / 12”), achieving surface roughness ≤ 10 nm
  • Precision grinding for polysilicon, compound semiconductors, and ceramic substrates
Recommended Specifications

Benchmarked against leading global manufacturers, featuring excellent self-sharpening performance and extended service life to meet diverse Si and SiC process requirements.

  • Grit Size: #800–#6000 (customizable)
  • Bond Type: Metal / Vitrified
  • Dimensions: Custom-built to match specific equipment and process requirements