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Draco Materials
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  • AboutExpand
    • About Draco

      DRACO Materials Technology is rooted in three core semiconductor processes—dicing, grinding, and polishing—delivering high-quality, highly customized solutions.

      Teams

      Backed by solid R&D and industry expertise, the DRACO team is committed to professionalism, accountability, and long-term trust.

      ESG Mission

      Committed to sustainable processes, employee safety, and advancing future technologies.

      ISO 9001 Certified

      Standardized quality management ensuring consistent performance and reliable delivery.

      Join DRACO

      Grow with us and shape the future together.

  • Products & ServicesExpand
    • Grinding Wheels

      Ensuring wafer flatness and surface quality.

      Diamond Discs

      High-precision, stable grinding.

      鑽石碟

      Dicing Blades

      Precise, long-life cutting solutions.

      Semiconductor Consumables & Equipment Distribution

      Integrated supply of semiconductor materials and equipment.

      Contract Manufacturing Services

      Professional wafer processing solutions.

  • Sustainability
  • Research
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  • Contact
Draco Materials

Terms of Use


1. Authorized Use of the Website
y accessing and using this website, you agree that system monitoring may be conducted for security or other lawful purposes. Any unauthorized use of this website may result in criminal prosecution or civil penalties.

2. Acceptance of These Terms
By accessing and using this website, you agree to comply with these Terms of Use and all applicable laws and regulations, including those relating to copyright, trademarks, intellectual property, and privacy rights.

3. Reservation of Rights
This website reserves the right to modify, add, or remove content and to change service features at any time without prior notice. These Terms of Use may also be revised at any time and will become effective immediately upon posting, without prior notice or liability to users.

  • Users shall not engage in any unlawful activity using this website or its related systems and services, including harassment, defamation, threats, or other criminal conduct.
  • All content displayed on this website, including corporate logos, trademarks, and service marks, is the property of the Company. Users may not access, use, reproduce, modify, distribute, publish, or transmit any content without authorization.
  • Users shall not perform any act that may harm the website or interfere with normal network transmission.
  • Users acquire no rights to the website or its content and may not use any information or services for unauthorized purposes.
  • Users shall not upload or transmit viruses or any malicious code intended to damage, disrupt, or impair system performance or service quality.

4. External Links
This website may contain links to third-party websites. The Company assumes no responsibility for the content, accuracy, or validity of such external sites.

5. Indemnification
Users who violate these Terms of Use or applicable laws shall be liable for any damages incurred by the Company or third parties as a result.

6. Governing Law
These Terms of Use shall be governed by the laws of the Republic of China (Taiwan).

DRACO Materials Technology specializes in critical semiconductor processes—including dicing, grinding, and polishing—delivering high-quality, highly customized material solutions.

Products & Services

  • Grinding Wheel
  • CMP Diamond Disk
  • Dicing Blade
  • Semiconductor Consumables
  • Contract Manufacturing

Support

  • Draco Research
  • Support

Contact

  • News Room
  • Join Draco
  • Contact Us

© 2026 天龍材料股份有限公司 Draco Materials All Rights Reserved.

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  • Home
  • About DRACO
    • Teams
    • Quality Policy
    • Join Draco
  • Products and Services
    • Grinding Wheel
    • CMP Diamond Disk
    • Dicing Blade
    • Semiconductor Consumables
    • Contract Manufacturing
  • Corporate Sustainability
  • Draco Research
  • News Room
  • Contact Us