DRACO Delivers Stable and Reliable Process Materials

DRACO Materials Technology specializes in the R&D and manufacturing of inorganic composite materials—including alloys, ceramics, and precision components—supporting critical semiconductor consumables from crystal growth, wafer slicing and grinding, front-end CMP, wafer thinning, to advanced packaging dicing. Our solutions fully support 8-inch to 12-inch wafer processes.

In response to global semiconductor capacity expansion and growing demand for grinding, polishing, and dicing consumables, DRACO leverages patented formulations, proprietary process technologies, and strong material compatibility to co-develop with leading customers—advancing from import dependence toward localized manufacturing and reinforcing supply chain resilience.

Supported by entrepreneurial agility, industry-academia collaboration, and multinational management expertise, our team adopts a mentorship-driven talent model to enhance cost efficiency, accelerate process integration, and strengthen localized operational excellence.