DRACO Materials – Localized Innovation for End-to-End Semiconductor Consumables

DRACO Materials Technology develops and manufactures proprietary solutions for grinding (abrasive wheels), polishing (diamond discs), and dicing (cutting blades).

Our core expertise lies in inorganic composite materials—including alloys, ceramics, and precision components—supporting critical semiconductor consumables from crystal growth, wafer slicing and grinding, front-end CMP, wafer thinning, to advanced packaging dicing. We fully serve 8-inch to 12-inch wafer processes.

In response to global capacity expansion and rising demand for grinding, polishing, and dicing consumables, we leverage patented formulations and process technologies to co-develop with leading customers—transitioning from import dependence to localized manufacturing and strengthening supply chain resilience.

Backed by entrepreneurial drive, industry-academia expertise, and multinational management experience, our team is committed to cost optimization, process innovation, and sustainable localization through a mentorship-driven talent model.